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By embedding PCI Express 5.0 and CXL support, Intel’s new FPGAs seek to tackle high-bandwidth computing workloads.
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The electronic components supply chain relies upon traceability and document security. Now, two new technologies will make this easier and more secure.
The company is rolling out 16 Schottky diodes in smaller Clip-bonded FlatPower packages, side-stepping some of the constraints of traditional SMX packages.
Nexperia says the new packaging option provides 75% PCB area savings and supports optical inspections.
TSMC will build a $177M chip R&D facility in Japan. It is also expanding production capacity to counter the impact of the semiconductor shortage.