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For battery-powered BLDC motor controls: Three-phase SOI-based gate driver MOTIX 6ED2742S01Q from Infineon at Rutronik
The company is rolling out 16 Schottky diodes in smaller Clip-bonded FlatPower packages, side-stepping some of the constraints of traditional SMX packages.
The Chinese government established a committee that includes Huawei, SMIC, and Alibaba, to develop new semiconductor development standards.
TE Connectivity AmbiMate Sensor Module MS4 Series offers an application specific set of sensors on a ready to attach PCB assembly for easy integration.
The LAN866x family integrates the Remote Control Protocol to eliminate edge node software and accelerate zonal Ethernet deployment.
Part 2 of our series examines the trends shaping the semiconductor industry in 2021. We take a look at materials, chip packaging, wearables and one issue that will impact chip production.