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Nexperia has announced a new portfolio of high signal integrity, bidirectional electrostatic discharge (ESD) protection diodes in flip-chip land-grid-array (FC-LGA) packaging.
Qualcomm made a six-year deal supply deal with UMC, the world’s fourth-largest contract chipmaker. Read more here.
Now that the automotive marketplace has had enough time to allow practical technology and production schedules to meet predictions from ten years ago, it looks like the electric vehicle era is finally
New AI upscaling tech points to a 2026 mobile graphics future driven by on-chip inference.
Pancon corporation will shut down their California and Massachusetts factories. In response, TE Connectivity and Adam Tech provide component crosses to assist current customers.
MRO is essential to production lines operating at full capacity, but procurement during this time of pandemic can be tricky. Here are some helpful tips.