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Nexperia introduces new high speed optimized flip-chip package technology for automotive ESD protection

Nexperia has announced a new portfolio of high signal integrity, bidirectional electrostatic discharge (ESD) protection diodes in flip-chip land-grid-array (FC-LGA) packaging.

Qualcomm reportedly inks six-year foundry services agreement with UMC

Qualcomm made a six-year deal supply deal with UMC, the world’s fourth-largest contract chipmaker. Read more here.

Will Electric Vehicles Create a Disconnect for Component Availability?

Now that the automotive marketplace has had enough time to allow practical technology and production schedules to meet predictions from ten years ago, it looks like the electric vehicle era is finally

Arm Reveals Plans to Outfit Its GPUs With Dedicated Neural Accelerators

New AI upscaling tech points to a 2026 mobile graphics future driven by on-chip inference.

Pancon Corporation to Close Two Manufacturing Plants: Adam Tech to Provide Component Crosses

Pancon corporation will shut down their California and Massachusetts factories. In response, TE Connectivity and Adam Tech provide component crosses to assist current customers.

The Vital Importance of MRO to Electronic Manufacturing Production Lines

MRO is essential to production lines operating at full capacity, but procurement during this time of pandemic can be tricky. Here are some helpful tips.

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