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Broadcom Unveils 200G Per Lane DSP PHYs to Bolster AI Infrastructure

While one of the new DSP PHYs reportedly offers the industry’s lowest power consumption for 800G, the other is the first 200G/lane DSP with integrated VCSEL drivers.

Infineon Upgrades Its Control MCUs for Post-Quantum Cryptography Transition

Announced today, the new MCUs future-proof industrial and data center systems in anticipation for the post-quantum world.

Rohm Blends Analog and Digital for Optimal Power Control

LogiCoA provides digital precision with power consumption equivalent to analog power supplies.

TSMC and Japanese government launching $337M 3D chip development project

TSMC and the Japanese government are co-funding a potentially revolutionary $337 million semiconductor research project.

Micron to ‘Revolutionize’ Smart Vehicles With First Quad-Port SSD

Micron simplifies data access in new vehicle architectures with its first multi-port automotive SSD.

Renesas Suspends Operations at Ibaraki Factory Following 7.3 Earthquake

Renesas has temporarily suspended production at one of its Japanese plants following a 7.3 magnitude earthquake in its vicinity.

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