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AMD Patent Filing Reveals Future CPU-FPGA Hybrid

Based on its recent patent filing, AMD has developed a new chip that harnesses the power of a CPU and the flexibility of an FPGA.

Nexperia launches industry leading 1200 V SiC MOSFETs in top-side cooled X.PAK

Nexperia launches industry leading 1200 V SiC MOSFETs in top-side cooled X.PAK

Electronic Components Traceability in 2020: 3 Things You Should Know

Traceability is one of the most important topics in the electronic components industry in 2020. Take a look at these 3 things to keep in mind.

Nvidia’s Jetson Nano unlocks the potential of the connected robotics & embedded analytics markets

Nvidia’s Jetson Nano SOM unlocks the potential of the nascent connected robotics and embedded analytics device markets.

Semiconductor industry kicks off 2022 with COVID production disruptions and rising chip prices

The electronic components industry is experiencing coronavirus-related supply chain disruptions and semiconductor price increases to kickoff 2022.

Pancon Corporation to Close Two Manufacturing Plants: Adam Tech to Provide Component Crosses

Pancon corporation will shut down their California and Massachusetts factories. In response, TE Connectivity and Adam Tech provide component crosses to assist current customers.

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