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Renesas Embeds Powerful Arm Cortex-M85 Into Entry-Level MCUs

2024-11-14

Renesas' new 32-bit MCUs maintain the power of its RA8 series MCUs while streamlining their features, making them cost-effective for high-volume embedded applications.

STMicroelectronics Rolls Out Biosensor for Health and Fitness Wearables

2024-11-07

ST’s new solution has a highly integrated analog front end for advanced wearable features.

BrainChip Accelerates AI at the Edge With New Low-Power Neural Processor

2024-11-01

The Akida Pico low-power acceleration co-processor may drive compact AI-enabled wearables and sensors for consumer, healthcare, and IoT applications.

Infineon’s Automotive Fingerprint Sensor IDs and Authenticates Drivers

2024-10-23

The new biometric fingerprint sensors may be a simple, accurate, and cost-effective way to identify drivers and approve in-vehicle personalization and payments.

TI’s PLDs Help Engineers Leap From Concept to Prototype in a Snap

2024-10-17

The new family of programmable logic devices highly integrates features to reduce board space by up to 94%.

Raspberry Pi Teams Up With Sony to Launch AI Camera

2024-10-09

The new AI camera integrates an intelligent vision processor and can be used with Raspberry Pi single-board computers.

NXP’s Battery Junction Box IC First to Sense, Think, and Act in One Chip

2024-09-28

The new chip measures currents, voltages, and temperatures in EV and hybrid-EV battery packs.

ETH Zurich Researchers Unlock the Key to One-Way Sound Waves

2024-09-20

While sound waves usually travel in two directions, researchers at ETH Zurich have discovered how to guide—and amplify—sound waves in one direction without losing energy.

Qualcomm Raises the Bar on Thin, Light PC Performance With New CPU

2024-09-14

The new Snapdragon X Plus 8-core is designed to uphold high-performance standards while extending battery life by multiple days on Copilot+ PCs.

Hot Chips Heavy Hitter: IBM Tackles Generative AI With Two Processors

2024-09-06

Announced this week at Hot Chips 2024, the new processors use a scalable I/O sub-system to slash energy consumption and data center footprint.