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TSMC is increasing its car MCU production to address the global chip shortage. But insiders believe the component crunch will last until 2022.
In this roundup, we highlight three embedded boards that come in versatile form factors for various applications.
Chipmakers are developing SiC and GaN parts production technologies to take advantage of the electric vehicle sector’s explosive growth.
Samsung plans to spend $17 billion on a new fabrication facility in Austin, Texas. The facility may feature EUV lithography machines for advanced components.
Based on four preconfigured software building blocks, Congatec's aReady.IOT streamlines and secures data transfer between different systems and devices.
TSMC’s new A14 process is already backed by certified EDA tools from Cadence, Synopsys, and Siemens to accelerate next-gen AI and chiplet-based designs.