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Nexperia launches industry leading 1200 V SiC MOSFETs in top-side cooled X.PAK

Nexperia launches industry leading 1200 V SiC MOSFETs in top-side cooled X.PAK

Automakers moving away from JIT inventory model post-global chip shortage

Because of the global chip shortage, leading car manufacturers are moving away from the “just-in-time” component inventory model.

EPC Gets Granular: Motor Drive Reference Design Targets Robotic Joints

EPC recently announced a new reference design for BLDC motor drives to provide intricate motor control in humanoid robots.

New Memory, Power, and MIMO Devices Target ‘NewSpace’ in Low Earth Orbit

As satellite constellations in low Earth orbit grow in scale and ambition, the demand for robust, compact, and cost-effective electronic components continues to rise.

New Power Components Tackle Tough Design Challenges

TDK, Littelfuse, and Novosense have released components targeting scalability, thermal resilience, and EMI issues.

STMicroelectronics Revs Up Production on New PowerGaN Transistors

As electronics become smaller, ST’s latest transistor family stands to shrink power electronics in tandem.

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