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Advanced Energy Pushes Rack-Level Power Efficiency Higher

The Evergreen Vento FCM33 delivers modular 33 kW shelves with over 95% efficiency for semiconductor and industrial DC power systems.

Synopsys Debuts Full-stack AI-based EDA Tool Suite for IC Engineers

At today’s Synopsys Users Group (SNUG) event, Synopsys has unveiled a full-stack suite of AI-based EDA tools.

Nexperia introduces new high speed optimized flip-chip package technology for automotive ESD protection

Nexperia has announced a new portfolio of high signal integrity, bidirectional electrostatic discharge (ESD) protection diodes in flip-chip land-grid-array (FC-LGA) packaging.

NXP Debuts Vehicle ‘Safety Cocoon’ Radar Sensor Solutions

NXP Semiconductors just introduced new vehicle radar sensor products to help manufacturers create digital safety cocoons for new cars.

SMIC Supply Partners Secure US Approval to Sell Chipmaker Mature Node Equipment

SMIC’s U.S. chip-making equipment vendors have secured Washington’s approval to resume work with the industry giant.

Targeting AI Workloads, Broadcom Reveals ‘World’s First 102.4 Tbps Switch’

Announced today, the high-performance switch IC enables scale-up and scale-out for AI networks and supports co-packaged optics.

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