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Streamlining the procurement process is top of mind for anyone working in the electronic components industry. Learn how digitalization is the next step.
Renesas has temporarily suspended production at one of its Japanese plants following a 7.3 magnitude earthquake in its vicinity.
Based on four preconfigured software building blocks, Congatec's aReady.IOT streamlines and secures data transfer between different systems and devices.
Foxconn and Yageo Corporation are teaming up to found a semiconductor company. The firm will focus on producing ‘small ICs.’
Based on its recent patent filing, AMD has developed a new chip that harnesses the power of a CPU and the flexibility of an FPGA.
The new memory delivers identification and traceability unique with a 128-bit read-only ID, including EEPROM capacities from 32 Kb to 2 Mb.