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Nexperia introduces new high speed optimized flip-chip package technology for automotive ESD protection

Nexperia has announced a new portfolio of high signal integrity, bidirectional electrostatic discharge (ESD) protection diodes in flip-chip land-grid-array (FC-LGA) packaging.

New Memory, Power, and MIMO Devices Target ‘NewSpace’ in Low Earth Orbit

As satellite constellations in low Earth orbit grow in scale and ambition, the demand for robust, compact, and cost-effective electronic components continues to rise.

Microsoft Announces New Custom CPU Powered by Arm

Azure Cobalt 200 aims to deliver a 50% performance gain over its predecessor for real-world cloud workloads.

Weebit’s ReRAM Is Now AEC-Q100 Qualified. What Does That Mean?

Announced at Embedded World 2025, Weebit Nano's ReRAM module has met a critical benchmark for ICs used in vehicles.

The Power of Sourcengine's API Integration with Orbweaver

Integrating Sourcengine's API to ERP or other systems is simple with Orbweaver. Receive part offers and data directly to your systems.

Foxconn and Stellantis to form Mobile Drive, an advanced digital cockpit company

Foxconn and Stellantis are joining forces to form a new advanced digital cockpit company called Mobile Drive.

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