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In a recent report, IDTechEx defined the who, what, and when of sustainable IC and PCB manufacturing.
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Based on four preconfigured software building blocks, Congatec's aReady.IOT streamlines and secures data transfer between different systems and devices.
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EPC recently announced a new reference design for BLDC motor drives to provide intricate motor control in humanoid robots.
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The eight-channel, 125 W laser diode SMD array improves the measurement distance and resolution in LiDAR applications.
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As we enter 2025, the semiconductor industry is at a crossroads of ongoing innovation and lurking uncertainty.
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Announced at CES today, NXP's new series of MCUs consume 3x less power than previous MCX devices with its ultra-low-power sense domain.
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On this New Years Day, we share 2025 predictions from leading companies in our industry.
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The Times Square Ball has come far from its first iron-and-wood model. Here's how the New Year's Eve icon has evolved over the past century.
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IBM divided and parsed the quantum solution into two connected quantum processing units, demonstrating greater processing capability than either individual unit.
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Nexperia says the new packaging option provides 75% PCB area savings and supports optical inspections.
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