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Nexperia has announced a new portfolio of high signal integrity, bidirectional electrostatic discharge (ESD) protection diodes in flip-chip land-grid-array (FC-LGA) packaging.
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The new device keeps the high-frequency switching benefits of GaN while addressing the historical lack of a true reverse body diode.
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The release marks Renesas' first AEC-Q100-qualified Bluetooth Low Energy SoC, offering a high level of integration and power efficiency.
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The new memory delivers identification and traceability unique with a 128-bit read-only ID, including EEPROM capacities from 32 Kb to 2 Mb.
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Nexperia launches industry leading 1200 V SiC MOSFETs in top-side cooled X.PAK
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In this roundup, we cover four newly announced parts from Nuvoton, Nexperia, TDK, and Microchip, targeting various systems in the modern vehicle.
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While one of the new DSP PHYs reportedly offers the industry’s lowest power consumption for 800G, the other is the first 200G/lane DSP with integrated VCSEL drivers.
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The chipmaker says its Blackwell processors have led to “an inflection point in engineering design.”
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Announced at Embedded World 2025, Weebit Nano's ReRAM module has met a critical benchmark for ICs used in vehicles.
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To address the increasing demand for high-performance, math-intensive applications in a wide range of industries, Microchip Technology has released the PIC32A family of MCUs.
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