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Renesas has developed two new semiconductor solutions for the growing IO-Link market. The new IO-Link solutions include a four-channel master IC and a dual-channel sensor signal conditioner IC.
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Renesas' new 32-bit MCUs maintain the power of its RA8 series MCUs while streamlining their features, making them cost-effective for high-volume embedded applications.
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ST’s new solution has a highly integrated analog front end for advanced wearable features.
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The Akida Pico low-power acceleration co-processor may drive compact AI-enabled wearables and sensors for consumer, healthcare, and IoT applications.
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The new biometric fingerprint sensors may be a simple, accurate, and cost-effective way to identify drivers and approve in-vehicle personalization and payments.
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The new family of programmable logic devices highly integrates features to reduce board space by up to 94%.
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The new AI camera integrates an intelligent vision processor and can be used with Raspberry Pi single-board computers.
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The new chip measures currents, voltages, and temperatures in EV and hybrid-EV battery packs.
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While sound waves usually travel in two directions, researchers at ETH Zurich have discovered how to guide—and amplify—sound waves in one direction without losing energy.
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The new Snapdragon X Plus 8-core is designed to uphold high-performance standards while extending battery life by multiple days on Copilot+ PCs.
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