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ST Rolls Out Battery Management IC for Lithium Packs Up to 10 Cells

2026-09-30

The L9962 integrates cell monitoring, balancing, protection, and a 3.3-V LDO in a 7 mm x 7 mm package and draws just 2 uA in deep sleep.

MediaTek Intros 3 nm SoC Designed for AI-First Googlebooks

2026-09-24

Announced today, MediaTek's new 3 nm Dimensity CX C10 Max SoC features an all-big-core Arm CPU and NPU 890 to bring flagship AI performance to fanless Googlebooks.

Delos Data Unveils Architecture and Silicon to Break AI Interconnect Bottlenecks

2026-09-18

Launched today, Delos Data’s Nonstop AI portfolio intros Apollo Data Interface silicon, the Morpheus development platform,

AMD to Bring UCIe Chiplet Connectivity to Versal RF Adaptive SoCs

2026-09-10

Select Versal RF Series devices will be AMD's first adaptive SoCs with native UCIe 1.1 interfaces, allowing designers to co-package third-party chiplets.

Microchip Reveals One of Its Lowest Power Atomic Clocks Yet

2026-09-03

Drawing less than 120 mW and tolerating 30 krad of total ionizing dose, the chip-scale atomic clock keeps LEO satellites synchronized when GNSS timing is unavailable.

Murata, TDK, and Knowles Raise Capacitor Expectations With New Lineups

2026-08-20

The new capacitors feature higher voltage ratings, improved thermal and vibration performance, and new safety qualifications for automotive and industrial applications.

Intel 14A Design Ecosystem Gains Support from Major EDA Partners

2026-08-14

Siemens, Cadence, Synopsys, and Keysight have certified new design tools, reference flows, IP, and simulation support for Intel 14A.

MEMS Sensors Measure Pressures as Low as 2 Bar in Gas and Liquid

2026-08-07

Melexis has added low-pressure variants with analog, LIN, and SENT output options to its Triphibian pressure sensor family.

Microchip’s Latest SDK Brings Sparse Neural Networks to PolarFire FPGAs

2026-07-30

Sparsity-based model compression from the Neuronix AI Labs acquisition promises up to 2x faster CNN inference on low-power, SEU-immune hardware.

MOSIS Partners With GlobalFoundries, Extending 40-Year Prototyping Legacy

2026-07-23

The USC-run service that pioneered multi-project wafers in 1981 now offers a path from shared shuttle runs to full production on GlobalFoundries' FinFET and FD-SOI processes.