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Swiss Startup Sets Out to Develop the World’s First Living Processor

FinalSpark has unveiled Neuroplatform, a pioneering approach to "bioprocessing" with wetware computing and organoid intelligence.

NXP Unlocks Higher IoT Efficiency and Security With New MCUs

Announced at CES today, NXP's new series of MCUs consume 3x less power than previous MCX devices with its ultra-low-power sense domain.

Toshiba Adds High-Speed CCD Image Sensor to Machine Vision Portfolio

The new linear sensor pushes the capture speed envelope for industrial machine vision.

IBM Demonstrates First ‘Multi-Processor’ for Quantum Processing

IBM divided and parsed the quantum solution into two connected quantum processing units, demonstrating greater processing capability than either individual unit.

How Digitalization Helps Manufacturers Become More Agile

Digitalization not only keeps production moving in the semiconductor industry, but it also creates agile companies that can pivot with a moment's notice.

Nexperia introduces new high speed optimized flip-chip package technology for automotive ESD protection

Nexperia has announced a new portfolio of high signal integrity, bidirectional electrostatic discharge (ESD) protection diodes in flip-chip land-grid-array (FC-LGA) packaging.

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