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Arm's third generation of its Neoverse IP is designed to maximize TCO for intensive workloads and support new technologies like chiplets.
Daimler executives predict the global chip shortage will continue affecting the corporation's manufacturing and sales through 2022.
TSMC’s new A14 process is already backed by certified EDA tools from Cadence, Synopsys, and Siemens to accelerate next-gen AI and chiplet-based designs.
The compact 60 GHz radar sensor includes an antenna in package, affording ultra-wide bandwidth FMCW operation with a single-chip solution.
The new transceivers aim to extend cable lengths while maintaining compliance with industry standards.