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TSMC and Japanese government launching $337M 3D chip development project

TSMC and the Japanese government are co-funding a potentially revolutionary $337 million semiconductor research project.

Approved Vendor Lists: Part 2

Don't have time to expand your AVL? Try using Sourcengine's free BOM Analysis tools on Sourcengine or for full-service sourcing, contact the Sourceability sales team.

ADI Intros ‘Most Advanced’ Software-defined Signal Processing Platform

With applications like phased array radar, electronic surveillance, T&M, and 6G in mind, ADI has released a next-gen signal processing platform.

Pancon Corporation to Close Two Manufacturing Plants: Adam Tech to Provide Component Crosses

Pancon corporation will shut down their California and Massachusetts factories. In response, TE Connectivity and Adam Tech provide component crosses to assist current customers.

Breaking AI Bottlenecks: 3 Startups Look Beyond the Chip

Lotus Microsystems, Oriole Networks, and Atomera have each rolled out technologies tackling the physical limits slowing AI infrastructure.

Oppo designing 3nm smartphone chipsets in-house, TSMC handling production

Oppo, a leading Chinese smartphone maker, reportedly plans to release self-designed 3nm SoCs for its future handsets.

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