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Deembedding Test Fixtures for High-Speed Digital Applications
The new processors promise 3:1 rack consolidation, 4.2x rack-level performance gains, and 2.6x performance per watt gains.
Announced today, the new device challenges the assumption that Ethernet can't support small packet sizes or optimized transport paths
Researchers are tackling key 6G challenges—from ultra-fast photonic AI for real-time RF processing to novel GaN amplifier behavior and ultra-compact phased-array packaging.
The new development kit helps designers create industrial systems incorporating actuators and sensors.