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Lattice’s New FPGAs Expand Possibilities for Control and Connectivity

The latest members of the low-power, low-density FPGA product line feature instant-on with 896 to 9400 look-up tables.

ST Rolls Out Battery Management IC for Lithium Packs Up to 10 Cells

The L9962 integrates cell monitoring, balancing, protection, and a 3.3-V LDO in a 7 mm x 7 mm package and draws just 2 uA in deep sleep.

Targeting AI Workloads, Broadcom Reveals ‘World’s First 102.4 Tbps Switch’

Announced today, the high-performance switch IC enables scale-up and scale-out for AI networks and supports co-packaged optics.

Renesas Introduces Industry’s First One-Chip 9-Axis Motion Control MPU

The new RZ/T2H chip combines multiple cores, real-time control, Ethernet, and advanced security into a one-chip microprocessor.

Nexperia investing $700M in capacity expansion, opens new production line in Britain

Nexperia is spending $700 million to expand its development capabilities and manufacturing capacity. And it just activated a new production line.

IBM Demonstrates First ‘Multi-Processor’ for Quantum Processing

IBM divided and parsed the quantum solution into two connected quantum processing units, demonstrating greater processing capability than either individual unit.

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