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NXP Unlocks Higher IoT Efficiency and Security With New MCUs

2025-01-09

Announced at CES today, NXP's new series of MCUs consume 3x less power than previous MCX devices with its ultra-low-power sense domain.

Industry Weighs in With 2025 Forecasts—Part 1: General Predictions

2025-01-02

On this New Years Day, we share 2025 predictions from leading companies in our industry.

How Times Square’s New Year’s Eve Ball Got Its Sparkle

2024-12-31

The Times Square Ball has come far from its first iron-and-wood model. Here's how the New Year's Eve icon has evolved over the past century.

IBM Demonstrates First ‘Multi-Processor’ for Quantum Processing

2024-12-25

IBM divided and parsed the quantum solution into two connected quantum processing units, demonstrating greater processing capability than either individual unit.

Nexperia Introduces Tiny Leadless Logic ICs for Automotive Designs

2024-12-19

Nexperia says the new packaging option provides 75% PCB area savings and supports optical inspections.

AMD Reveals Adaptive SoCs With RF Conversion and 80 TOPS DSP

2024-12-13

Announced today, the new series integrates RF-sampling converters and high-performance compute on a single chip.

Renesas Introduces Industry’s First One-Chip 9-Axis Motion Control MPU

2024-12-05

The new RZ/T2H chip combines multiple cores, real-time control, Ethernet, and advanced security into a one-chip microprocessor.

NXP Debuts Applications Processors for Industrial and Automotive Designs

2024-11-29

The new processor family offers a combination of real-time control and communications features.

Renesas Releases Two New IO-Link Enhancing Devices

2024-11-20

Renesas has developed two new semiconductor solutions for the growing IO-Link market. The new IO-Link solutions include a four-channel master IC and a dual-channel sensor signal conditioner IC.

Renesas Embeds Powerful Arm Cortex-M85 Into Entry-Level MCUs

2024-11-14

Renesas' new 32-bit MCUs maintain the power of its RA8 series MCUs while streamlining their features, making them cost-effective for high-volume embedded applications.