Nexperia Introduces Tiny Leadless Logic ICs for Automotive Designs

Nexperia says the new packaging option provides 75% PCB area savings and supports optical inspections.

Nexperia recently introduced new leadless, miniaturized logic ICs under its SOT8065-1 MicroPak XSON5 packaging. This new packaging expands Nexperia’s logic portfolio to target automotive applications requiring smaller PCB footprints and side-wettable flanks.

Nexperia’s MicroPak XSON5 leadless packaging allows designers to use them in space-constrained automotive designs.

Nexperia claims that the new packaging options will support space-constrained automotive applications. This includes chassis safety systems, battery monitoring units, and advanced driver assistance systems (ADAS).

Compact Packaging for Space-Constrained Designs

The SOT8065-1 MicroPak XSON5 features a thermally enhanced plastic enclosure, supporting the automotive industry's move from larger, traditionally leaded packaging to smaller leadless packaging.

SOT8065’s package outline. 

This transition aims to lower production costs and adapt to space-constrained applications. The SOT8065-1 features five terminals and measures 1.1 mm × 0.85 mm × 0.47 mm. Nexperia says that this provides a 68% PCB area saving compared to SOT353 leaded packaging while maintaining high quality. Nexperia also claims that the SOT8065-1-based devices suffer zero delamination and offer immunity to moisture up to MSL-1.

The RoHS and dark green compliant ICs also feature 7-μm Sn layers on their pads and bottom to reduce oxidation.

Side-Wettable Flanks for Optical Inspection

Another notable feature of the new packaging is its side-wettable flanks. Side-wettable flanks refer to terminal placements that improve manufacturing reliability by enabling automated optical inspection (AOI) to inspect solder joints.

Side-wettable flanks allow easy optical inspection.

Typical IC terminal placement often requires X-ray-based machines to perform automated inspection of its solder joints. These set-ups are expensive to purchase and operate. Side-wettable flanks force solder filets along the side wall of the pads, allowing for visual inspection of solder joints. This means that manufacturers can utilize AOI to automate inspection while reducing costs.

Smaller Sizes for Smaller Automotive Systems

Nexperia offers 64 AEC-Q100-certified devices under this new packaging. The portfolio includes two-input logic gate ICs and inverters as well as D-type flip-flops, buffers, Schmitt triggers, and bilateral switches. Most of the ICs operate around 2.0 V to 6.0 V and have an output drive in the mA range.